At the 2024 IEEE International Electronic Devices Conference, Intel's chip foundry business unit showcased multiple technological breakthroughs. In terms of new materials, the company showcased its subtractive ruthenium interconnect technology, which can reduce inter line capacitance by up to 25% and improve intra chip interconnects. In terms of packaging technology, Intel foundry has also announced a heterogeneous integration solution for advanced packaging, which can increase throughput by up to 100 times and achieve ultra fast chip to chip assembly.
In addition, to further promote the miniaturization of fully enclosed gate (GAA), Intel has also introduced silicon-based RibbonFET CMOS (complementary metal oxide semiconductor) technology and gate oxide modules for miniaturized 2D field-effect transistors (2D FETs).