On the afternoon of January 18th, TSMC held a corporate briefing on the progress of advanced packaging for artificial intelligence (AI) chips. President Wei Zhejia pointed out that the demand for advanced packaging for AI chips continues to be strong, and the current situation is that production capacity cannot meet the strong demand of customers, and the supply-demand situation may continue until 2025. Wei Zhejia stated that TSMC will continue to expand its advanced packaging capacity this year, and the plan for advanced packaging capacity to double this year is still in short supply. It is estimated that TSMC will continue to expand its production capacity in 2025.