On Thursday of this week, South Korean SK Hynix announced that it has started mass production of the world's first 12 layer HBM3E product, with a capacity of 36GB, which is the largest capacity of existing HBMs to date.
SK Hynix claims that the 12 layer HBM3E product meets the world's highest standards in terms of speed, capacity, and stability. The company plans to provide mass-produced products to customers within the year.
Affected by this news, SK Hynix's stock price surged on the Korean stock market on Thursday. As of press time, the company's stock price has risen by 8.89% within the day.
SK Hynix takes the lead in achieving mass production of 12 layer HBM
In March of this year, SK Hynix delivered 8-layer HBM3E products to customers, setting a new record in the industry. After a six-month hiatus, SK Hynix is once again the industry's first to achieve mass production of 12 layer HBM3E chips, once again proving its technological advantages.
SK Hynix is the only company that has developed and supplied all HBM series from the first generation (HBM1) to the fifth generation (HBM3E) since the launch of the world's first HBM in 2013.
Now, SK Hynix has achieved mass production of 12 layer HBM3E, which will meet the growing demand of artificial intelligence enterprises and continue to maintain its leading position in the artificial intelligence memory market.
SK Hynix President Justin Kim said, "SK Hynix has once again broken through the technological limitations of the AI memory field, demonstrating our industry-leading position in the AI memory field... In order to overcome the challenges of the artificial intelligence era, we will steadily prepare the next generation of memory products and continue to maintain our position as the world's number one
Speed, capacity, and stability all meet the highest standards
According to the company, the 12 layer HBM3E product meets the world's highest standards in all areas necessary for artificial intelligence storage, including speed, capacity, and stability.
SK Hynix has increased its memory running speed to 9.6 Gbps, which is currently the highest available memory speed. If the large language model Llama 3 70b is driven by a single GPU equipped with four HBM3E products, it can read a total of 70 billion parameters 35 times per second.
Compared to the previous 8-layer product with the same thickness, SK Hynix's 12 layer product has increased capacity by 50%. To achieve this goal, the company will make each DRAM chip 40% thinner than before and use TSV technology for vertical stacking.
The company also solved the structural problem caused by stacking thinner chips higher by applying its core technology Advanced MR-MUF process. This makes the heat dissipation performance of the new generation product 10% higher than the previous generation product, and ensures product stability and reliability by enhancing warpage control.