The latest report from Trendforce shows that the demand for customized chips and packaging area is increasing due to AI applications, which is driving up CoWoS demand by 2025. Observing the important development trend of the CoWoS market next year: Firstly, by 2025, Nvidia's demand for TSMC CoWoS will increase to nearly 60%, driving TSMC's monthly CoWoS production capacity to nearly double by the end of the year, reaching 75000 to 80000 pieces; 2、 After the gradual increase in volume of Nvidia's Blackwell new platform in the first half of 2025, it is expected to drive the demand for CoWoS-L to surpass CoWoS-S, accounting for over 60%; 3、 CSP actively invests in ASIC AI chip construction, and AWS and other companies will also see a significant increase in demand for CoWoS by 2025.