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英飞凌宣布推出全球最薄硅功率晶圆

今早我梦醒了坎
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【英飞凌宣布推出全球最薄硅功率晶圆】10月29日,英飞凌宣布推出全球最薄硅功率晶圆,成为首家掌握20μm超薄功率半导体晶圆处理和加工技术的公司。
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今早我梦醒了坎
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